Redefining batch spray
Siconnex rethinks batch spray methodology, enabling semiconductor manufacturers to achieve high throughput and process results on single wafer level. Our innovative system ensures that wafers rotate on their own axis, maintaining a uniform spray pattern. This efficiency allows our customers to minimize process media and labor costs while significantly increasing throughput and profitability.
Why BATCHSPRAY®?
We have significantly reduced our consumption of chemicals and process media, contributing to a greener and more environmentally friendly approach.
Improved semiconductor product quality with advanced technologies, boosting performance and reliability.
Our company specializes in innovative batch spray solutions for the minimization of waste, promoting sustainability at every step.
Through cutting-edge advancements, we prioritize enhancing user safety, ensuring a secure and reliable handling.
With our equipment, we achieve a significant reduction in the required clean-room space for our customers, ensuring higher productivity per square meter.
Saves resources & guarantees quality
Multiple nozzles and wafer rotation ensure a uniform spray pattern of over 99%. Siconnex’s technology reduces total operating costs by up to 80% compared to wet benches.
*Compared to conventional wet benches
Functionality of the Siconnex Batch Spray Method
The batch spray system is a technology designed for conducting wet processes on an entire lot of wafers simultaneously. It can handle either 25 wafers of 300 mm size or 50 wafers of 200 mm or smaller sizes in a single process step. Wafers are placed into a rotor system consisting of a main rotor and an insert made of a specialized non-stick material. The main rotor and insert, along with the wafers, are situated within a process chamber. To accommodate various wafer sizes, different inserts are used. The wafers are positioned in the insert using either a clamshell or a process carrier. The rotor is housed inside a chamber made of the same non-stick material and can rotate in either a clockwise or counterclockwise direction while chemicals are sprayed from the chamber’s sidewalls.
The process chamber is equipped with four nozzle bars. Two of these bars are designated for chemical treatments, while the other two are used for rinsing and drying the wafers. The chemical nozzle bars are equipped with 19 spray nozzles, ensuring coverage of all wafers within the chamber. The overlapping spray patterns from the nozzles enhance the uniformity of the chemical application. Similarly, the rinse nozzle bars contain 17 nozzles that provide consistent rinsing. With a 1% flow deviation, a specific dispense angle, and carefully chosen nozzles, the system achieves a uniform distribution of the processing media.