BATCHSPRAY® and SicOzone™ Reduce Chemical Consumption Significantly
Batch spray cleaning with the SicOzone™ process ensures high throughput, low media consumption, and reliable performance. Additionally, spiking technology with ozone achieves cleanliness levels on par with traditional methods.
Siconnex to Present Integrated Etch & Strip Solution for SiC at CS International
Bernhard Hammerl will present the Integrated Metal Etch and Photoresist Strip Solution for SiC Manufacturing at the event, scheduled for 9:30 AM on April 9, 2025.
Siconnex, an Austrian wet process equipment manufacturer, has partnered with Yokogawa Solution Services Co., Ltd., a Tokyo-based provider of measurement and process control solutions.
Significantly Reduce Costs by Eliminating Solvents
Polymer residues from dry etching are a common challenge in semiconductor manufacturing. While this critical method offers precision and efficiency, it can leave behind contaminants that may disrupt subsequent processes.
With great joy and pride, we announce that Siconnex has won the prestigious 2024 Export Award by Außenwirtschaft Austria in the Handcraft & Trade category.
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