End Point Detection
The EPD System is an application to control the etching of metal layers. The light source shines on the first wafer, the reflected wavelength is recorded by the spectrometer. Etching through a layer changes the reflected wavelength. These changes are evaluated and used to define when the etching is at the desired end point. With the EPD system, a fully automated etching of the metal is possible. Furthermore, etch result consistency is achieved because influences like concentration of the chemical or temperature are eliminated.
Features and benefits
Suitability
for almost every metal etch process
Accurate process control
Several oxides are possible
Numerical wavelength analysis
Availability
for all chamber types
Run to Run uniformity
≤ 5%
EPD Live Spectrum visible