BATCHSPRAY®

Acid/Clean
Autoload

General features

Non-uniformity <1%

Controlled wafer rotation combined with smart chemical spray gain leads to excellent uniformity.

Throughput up to 400 wph

Intelligent wafer handling meets experienced wafer processing.

Fully automated

A robot tranfers the wafer batch from loadport into the process chamber.

1 acid and 2 clean process chambers

Thanks to a clever assembly of process modules, we achieve three process chambers.

Footprint <12 m²

Small process module footprint combined with smart wafer handling.

EPD - end point detection system

Only for acid applications

Chemical recirculation by tank system

Recirculation of the chemical provides a stable temperature and concentration condition. Only for acid applications.

Optional automation features

Dedicated handlers for dirty in/clean out handling

For enhanced wafer handling efficiency, we offer dedicated handlers specifically designed for dirty in/clean out processes. These specialized handlers ensure optimal cleanliness and prevent cross-contamination, maintaining the highest standards of wafer integrity.

Dedicated handlers for left and right process chamber

To capture your unique process requirements, our equipment includes dedicated handlers for both left and right process chambers. This tailored approach maximizes workflow flexibility, enabling seamless integration into your existing setup for improved productivity and convenience.

DNA of our equipment

BATCHSPRAY® Technology

BATCHSPRAY®, our core technology of all our wet chemistry equipment, offers efficient chemical-based cleaning, etching, rinsing, and drying within a versatile process chamber. It accommodates one carrier with 25 wafers or two carriers with 50 wafers and can run up to four chambers simultaneously, achieving throughputs of up to 600 wafers per hour.

Wafer size

Wafer materials

Feasible applications

Etch
Clean
Resist Strip
SicOzone

Suitable features

EPD
BATCHSPRAY® Acid/Clean Autoload

Countable benefits

This three-chamber system features all types of wet etch processes together with clean applications using the patented Retainer Comb Handling system. The acid/clean combination leads to high process flexibility and increased throughput. With sustainable processes like cleaning or resist stripping using SicOzone instead of peroxide and sulfuric acid, savings of up to 90% in the consumption of chemicals and DI water can be achieved.

0%
Consumption of Chemicals & DI Water (up to)

*Compared to conventional processes

Green Goals. Yellow Solutions.

Technology is all around us, shaping our daily lives and making them better. Siconnex is redefining progress by merging technology and sustainability, no longer presenting them as opposites. Sustainable technology for the progress of tomorrow. Green Goals. Yellow Solutions.